Below you will find a fairly dense overview of our manufacturing capabilities. The information should be up-to-date, but if anything you find yourself needing more information, or wish to contract us to manufacture your product, please feel free to contact us.
Printed Circuit Boards
We can procure PCBs from our supplier network if desired.
|1-X Layers||Yes||2–14 days *|
|Flexible Strip||Yes||2–14 days *|
We are able to procure stencils for new or existing boards.
Solder Screen Printing
We can print leaded or lead-free solder to a high standard of accuracy. Printing operations are a significantly simpler process if matching fiducials are available on the stencil and board. If we procure the PCBs we will also procure the relevant stencils.
Automated In-Line Printing (Autotronik AP430L)
|Size (min)||50 x 50 mm|
|Size (max)||450 x 300 mm|
|Thickness||0.4 - 5 mm|
|Stencil (min)||520 x 300 mm|
|Stencil (max)||736 x 736 mm|
Surface-Mount Component Placement
SMD placement is performed automatically by an in-line Jukee X or, when larger components are in-use, an Autotronik X. Manual placement of components which do not fit within the below parameters is available.
Our Juki KE-3020VAL runs in-line with our automated stencil printer and can handle low, medium, and high volume production. The placement monitoring system captures images before, during, and after placement to allow fine-tuning of placement without guess-work. The 21-tray matrix changer allows for a large number of different ICs to be placed per-board.
|Accuracy||+- 0.005 mm|
|Component Size (min)||1.0 x 0.5 mm (0402 imperial, 1005 metric)|
|Component Size (max)||~48 mm (or 24 x 72 mm)|
|PCB Size (min)||330 x 250 mm|
|PCB Size (max)||800 x 360 mm (re-homing)|
|Height (max)||20 mm|
|Chips Per Hour||20,900|
|ICs Per Hour||9,470|
|Nozzles||7 (6 chip, 1 IC)|
|Feeders (8mm)||50 (dual lane, 100 reels)|
|Accuracy||+- 0.04 mm|
|Component Size (min)||0.4 x 0.2 mm (0201 [0603 metric])|
|Component Size (max)||150 x 100 mm|
|Height (max)||5 mm|
|Chips Per Hour||6,400|
Unusual or difficult surface-mount components can be placed manually prior to reflow, where suitable. For more information, contact us.
We offer vacuum vapor phase (ASSCON VP800 Vacuum), vapor phase (ASSCON VP450 or VP800 without vacuum hood), or infrared hot air reflow (Puhui T-960E) options. We recommend vacuum vapor phase where board dimensions allow, as it reduces solder connection voiding to below 1%.
|Capability||Maximum Size Limit (mm)|
|Vacuum Vapor-Phase||480 x 295 mm|
|Vapor-Phase||610 x 460 mm|
|Infrared Hot-Air||300 x 300 mm|
Through-Hole & Manual Soldering
Manual post-reflow soldering is performed to IPC-601A standards by fully trained professionals. Hot-air rework is available for correcting defective products.
Post-reflow inspection is carried out on a SEC X-eye 5100F, allowing quick and easy identification of any potential issues with BGA connections. Any errors are corrected for future boards and repaired using our hot-air rework station on any defective boards.
We can accommodate your custom acceptance testing requirements; for more information, contact us.
Production Firmware Installation
We can perform firmware installation; for more information, contact us.